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User’s Manual U16898EJ6V0UD
12
18.7.1
Flash memory programming mode ............................................................................................ 277
18.7.2
Communication commands ....................................................................................................... 277
18.7.3
Security settings ........................................................................................................................ 278
18.8 Flash Memory Programming by Self Programming .............................................................279
18.8.1
Outline of self programming....................................................................................................... 279
18.8.2
Cautions on self programming function ..................................................................................... 282
18.8.3
Registers used for self programming function ........................................................................... 282
18.8.4
Example of shifting normal mode to self programming mode .................................................... 291
18.8.5
Example of shifting self programming mode to normal mode .................................................... 294
18.8.6
Example of block erase operation in self programming mode ................................................... 297
18.8.7
Example of block blank check operation in self programming mode ......................................... 300
18.8.8
Example of byte write operation in self programming mode ...................................................... 303
18.8.9
Example of internal verify operation in self programming mode ................................................ 306
18.8.10
Examples of operation when command execution time should be minimized in self programming
mode ......................................................................................................................................... 310
18.8.11
Examples of operation when interrupt-disabled time should be minimized in self programming
mode ......................................................................................................................................... 317
CHAPTER 19 ON-CHIP DEBUG FUNCTION .......................................................................................328
19.1 Connecting QB-MINI2 to 78K0S/KA1+ ...................................................................................328
19.1.1
Connection of INTP3 pin............................................................................................................ 329
19.1.2
Connection of X1 and X2 pins ................................................................................................... 330
19.2 Securing of user resources.....................................................................................................331
CHAPTER 20 INSTRUCTION SET OVERVIEW .................................................................................332
20.1 Operation ..................................................................................................................................332
20.1.1
Operand identifiers and description methods ............................................................................ 332
20.1.2
Description of “Operation” column ............................................................................................. 333
20.1.3
Description of “Flag” column...................................................................................................... 333
20.2 Operation List ...........................................................................................................................334
20.3 Instructions Listed by Addressing Type ...............................................................................339
CHAPTER 21 ELECTRICAL SPECIFICATIONS (Standard product, (A) grade product) .................342
CHAPTER 22 ELECTRICAL SPECIFICATIONS ((A2) grade product)................................................354
CHAPTER 23 PACKAGE DRAWING ..................................................................................................368
CHAPTER 24 RECOMMENDED SOLDERING CONDITIONS...........................................................371
APPENDIX A DEVELOPMENT TOOLS...............................................................................................373
A.1
Software Package ....................................................................................................................376
A.2
Language Processing Software .............................................................................................376
A.3
Flash Memory Writing Tools ...................................................................................................377
A.3.1
When using flash memory programmer PG-FP5 and FL-PR5................................................... 377
A.3.2
When using on-chip debug emulator with programming function QB-MINI2 ............................. 377
A.4
Debugging Tools (Hardware) ..................................................................................................377
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